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Research on Optimal Design of High-frequency-density Power Electronics PCB

Release date:2023-01-17  Number of views:3062   Amount of downloads:1174   DOI:10.19457/j.1001-2095.dqcd24543

      Abstract: In the period of high and new technology development,the application of SiC and other new

semiconductors promotes the development of PCB design toward integration and high efficiency. The new ideas were provided for PCB design optimization from two aspects of high frequency and high density. Among them,the

requirement of stray coefficient for PCB design was put forward by the high frequency,while high density was aimed at solving the thermal problem of PCB. On the one hand,vertical multi loop PCB layout was used to reduce parasitic parameters of power circuit and drive circuit,and compared with the vertical power loop layout,the grid circuit parasitic inductance was reduced about 50% in this method,while power circuit parasitic inductance was reduced about 30%. In this method,ringing and overshoot caused by the parasitic inductance also could be reduced,and rise and fall time of the voltage and current and switching losses were also reduced. On the other hand,the high power density thermal management method was improved. By optimizing design parameters such as PCB heat dissipation through holes and copper foil area,PCB was redesigned according to actual engineering needs to obtain an effective bottom cooling method. Through the simulation experiment and physical experiment,it is verified that the optimization scheme proposed has important guiding significance to design PCB with good performance.


      Key words: printed circuit board(PCB);parasitic inductance;switching loss;thermal management;bottom

cooling




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